Properties of lead-free solder SnAgCu containing minute amounts of rare earth-Reference-Cited by-同舟云学术

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Properties of lead-free solder SnAgCu containing minute amounts of rare earth

Published:2003-04 Issue:4 Volume:32 Page:235-243
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Chen Zhigang,Shi Yaowu,Xia Zhidong,Yan Yanfu

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-003-0215-y.pdf

Reference15 articles.

1. B. Richards and K. Nimmo, An Analysis of the Current Status of Lead-Free Soldering—Update 2000 (UK: Department of Trade and Industry, 2000).

2. S. Grum, Electron. Packag. Prod. 40, 13 (2000).

3. D.R. Frear, Electrotech. Informationstech. 118, 81 (2001).

4. B. Salam, N.N. Ekere, and D. Rajkumar, Electron. Comp. Technol. Conf. 2001, pp. 471–477.

5. N.-C. Lee, Adv. Microelectron. 26, 29 (1999).

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2. Structural, thermal and mechanical properties of rapidly solidified Bi-0.5Ag lead-free solder reinforced Tb rare-earth element for high performance applications;Soldering & Surface Mount Technology;2024-02-09

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4. Microstructure, electrochemical and mechanical properties of novel Zn–Sn–Cu–Ni high-temperature solder containing a small amount of Al;Journal of Materials Science: Materials in Electronics;2023-08

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