Trends and issues in Pb-free soldering for electronic packaging
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering
Link
http://link.springer.com/content/pdf/10.1007/BF03157756.pdf
Reference29 articles.
1. Glazer, J.: Metallurgy of low temperature Pb-free solder for electronic assembly. International Materials Reviews, vol. 40 (1995), no. 2, pp. 65–93.
2. Glazer, J.: Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: a review. J. of Electron. Materials, vol. 23 (1994), no. 8, pp. 693–700.
3. National Center for Manufacturing Sciences: Pb-Free Solder Project Final Report, #0401RE96, 1999.
4. Kang, S. K., Sarkhel, A. K.: Pb-free solders for electronic packaging. J. Electron. Materials, vol. 23 (1994), no. 8, pp. 701–707.
5. Vianco, P. T., Erickson, K. L., Hopkins, P. L.: Solid state intermetallic compound growth between Cu and high temperature Sn-rich solders — Part I: experimental analysis. J. Electron. Materials, vol. 23 (1994), no. 8, pp. 721–727.
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