Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: Experimental analysis-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: Experimental analysis

Published:1994-08 Issue:8 Volume:23 Page:721-727
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Vianco P. T.,Erickson K. L.,Hopkins P. L.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02651365.pdf

Reference7 articles.

1. Binary Alloy Phase Diagrams, ed. T. Massalski (Materials Park, OH: ASM Intl., 1986), p. 965.

2. K. Tu and R. Thompson,Acta Metall. 30, 947 (1982).

3. D. Unsworth and C. Mackay,Trans. Inst. Met. Finishing 51, 85 (1973).

4. L. Zakraysek,Welding J. 51, 536s (1972).

5. J. Stephens, Internal Memorandum, Sandia National Labo- ratories, March 2, 1989.

Cited by 115 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. In or Ni addition on mechanical properties and interfacial growth in Sn–35Bi–1Ag solder joint during isothermal aging;Journal of Materials Science: Materials in Electronics;2023-07

2. SurfaceTreatment and Solder Jointing Technology of Power Module for xEV;Journal of The Surface Finishing Society of Japan;2023-06-01

3. Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints;Journal of Materials Science: Materials in Electronics;2022-01-05

4. Studies of Cu-Sn interdiffusion coefficients in Cu3Sn and Cu6Sn5 based on the growth kinetics;Scripta Materialia;2021-11

5. Atomistic simulations of Ag–Cu–Sn alloys based on a new modified embedded-atom method interatomic potential;Journal of Materials Research;2021-10-18

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3