Kinetics of interfacial reaction in bimetallic CuSn thin films-Reference-Cited by-同舟云学术

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Kinetics of interfacial reaction in bimetallic CuSn thin films

Published:1982-05 Issue:5 Volume:30 Page:947-952
ISSN:0001-6160
Container-title:Acta Metallurgica
language:en
Short-container-title:Acta Metallurgica

Author:

Tu K.N.,Thompson R.D.

Publisher

Elsevier BV

Subject

General Engineering

Reference16 articles.

1. Interdiffusion and reaction in bimetallic Cu-Sn thin films

2. Constitution of Binary Alloys;Hansen,1958

3. Interstitial Diffusion of Copper in Tin

4. Int. Conf. on Vacancies and Interstitials;Anthony,1968

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