Role of Cu microstructure during isothermal aging of Cu/Sn/Cu micro solder joints
Author:
Funder
National Natural Science Foundation of China
Natural Science Foundation for Young Scientists of Jiangsu Province
Graduate Practice and Innovation Projects in Jiangsu Province
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s10853-024-09651-z.pdf
Reference41 articles.
1. Li Y, Goyal D (2020) 3D Microelectronic packaging: from architectures to applications, vol 64. Springer, Cham
2. Wang C, Chen Y, Liu ZQ (2020) Influence of external interface normal stress on the growth of Cu–Sn IMC during aging. Acta Metall Sin 33:1388–1396
3. Gusak AM, Tu KN, Chen C (2020) Extremely rapid grain growth in scallop-type Cu6Sn5 during solid–liquid interdiffusion reactions in micro-bump solder joints. Scr Mater 179:45–48
4. Li ML, Gao LL, Zhang L, Long WM, Zhong SJ, Zhang L (2021) Interfacial evolution of pure Sn solder bearing silicon carbide nanowires under isothermal aging and thermal cycling. J Mater Res Technol 15:3974–3982
5. Shi Q, Zhang ZJ, Gao X, Wei H, Zhou X (2022) Fabrication of full intermetallic compound interconnects with single crystal (111) Cu under bump metallization. In: 2022 23rd International conference on electronic packaging technology (ICEPT) (pp. 1–4). IEEE
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