1. R. Terrill, G.L. Beene, IEEE Aerosp. Appl. Conf. Proc. 2, 347 (1996)
2. K.N. Tu, Y. Liu, Mater. Sci. Eng. R 136, 1 (2019)
3. J.H.L. Pang, D.Y.R. Chong, T.H. Low, IEEE Trans. Compon. Packag. Technol. 24, 705 (2001)
4. C. Noritake, P. Limaye, M. Gonzalez, B. Vandevelde, in 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (2006)
5. K.N. Tu, Microelectron. Reliab. 51, 517 (2011)