Interfacial evolution of pure Sn solder bearing silicon carbide nanowires under isothermal aging and thermal cycling
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference19 articles.
1. Interfacial reaction and shear strength of ultrasonically-assisted Sn-Ag-Cu solder joint using composite flux;Wang;J Manuf Process,2021
2. Inhibition of intermetallic compounds growth at Sn-58Bi/Cu interface bearing CuZnAl memory particles (2-6 μm);Zhang;J Mater Sci Mater Electron,2020
3. A review: on the development of low melting temperature Pb-free solders;Kotadia;Microelectron Reliab,2014
4. Interfacial reaction, shear behavior and microhardness of Cu-Sn TLP bonding joints bearing CuZnAl powder for 3D packaging;Sun;J Manuf Process,2021
5. Effect of CNTs on the intermetallic compound growth between Sn solder and Cu substrate during aging and reflowing;Xu;J Mater Sci Mater Electron,2021
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1. In-situ isothermal aging TEM analysis of a micro Cu/ENIG/Sn solder joint for flexible interconnects;Journal of Materials Science & Technology;2024-01
2. Step phenomenon of intermetallic compounds thickness during laser soldering dependence on laser power;Journal of Manufacturing Processes;2023-12
3. Corrosion problems of SAC-SiC composite solder alloys;Corrosion Science;2023-11
4. Comprehensive analysis of Sn58Bi/Cu solder joints reinforced with Mg particles: Wettability, thermal, mechanics, and microstructural characterization;Journal of Materials Research and Technology;2023-11
5. Effect of Si3N4 nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding;Soldering & Surface Mount Technology;2023-09-22
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