Comprehensive analysis of Sn58Bi/Cu solder joints reinforced with Mg particles: Wettability, thermal, mechanics, and microstructural characterization

Author:

Huang Xi,Zhang LiangORCID,Chen Chen,Lu Xiao,Wang Xi

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference39 articles.

1. Silk fibroin for flexible electronic devices;Zhu;Adv Mater,2016

2. Sustainable natural bio-origin materials for future flexible devices;Ling-yi;Adv Sci,2022

3. Study on the floating kinetics of graphene in molten Sn-based alloy based on in-situ observation of X-ray radiography;Yuan;Composites Part B: Engineering,2022

4. Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints;Wang;Mater Char,2020

5. Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys;Silva Bismarck;J Alloys Compd,2017

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