Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys
Author:
Funder
FAPESP
CAPES-COFECUB
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference22 articles.
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3. Lead-free Solder Project Final Report. National Center for Manufacturing Sciences;NCMS,1997
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5. Effects of Zn, Zn-Al and Zn-P additions on the tensile properties of Sn-Bi solder;Wang;Acta Metall.,2014
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