Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys
Author:
Funder
FAPESP
CAPES-COFECUB
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference22 articles.
1. Lead-free solders in microelectronics;Abtew;Mater. Sci. Eng. R.,2000
2. Effects of minor Cu and Zn additions on the thermal, microstructure and tensile properties of Sn-Bi-based solder alloys;Shen;J. Alloys Compd.,2014
3. Lead-free Solder Project Final Report. National Center for Manufacturing Sciences;NCMS,1997
4. Correlation between microstructure and mechanical properties of Sn–Bi–X solders;Mokhtari;Mater. Sci. Eng. A,2016
5. Effects of Zn, Zn-Al and Zn-P additions on the tensile properties of Sn-Bi solder;Wang;Acta Metall.,2014
Cited by 47 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Microstructural evolution and failure mechanism dominated by Bi, Sb cooperative diffusion at p-type thermoelectric pillar Bi-Sb-Te/Sn interface;Applied Surface Science;2023-12
2. Comprehensive analysis of Sn58Bi/Cu solder joints reinforced with Mg particles: Wettability, thermal, mechanics, and microstructural characterization;Journal of Materials Research and Technology;2023-11
3. Impact of Cooling Rate and Nickel Addition on the Dendritic Spacing, Ag3Sn Morphology and Cytotoxicity of Sn-2Ag Solder;Journal of Electronic Materials;2023-09-12
4. Microstructure evolution at the interface between Cu and eutectic Sn–Bi alloy with the addition of Ag or Ni;Journal of Materials Research and Technology;2023-09
5. Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy;Journal of Materials Research and Technology;2023-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3