Correlation between microstructure and mechanical properties of Sn–Bi–X solders
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference27 articles.
1. A review: On the development of low melting temperature Pb-free solders
2. The effect of aging on microstructure, room temperature deformation, and fracture of Sn-Bi/Cu solder joints
3. The properties of tin-bismuth alloy solders
4. Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy
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