1. Lists of commercially available solders, for example Indalloy Specialty Solders and Alloys (Utica, NY: The Indium Corporation of America).
2. R.N. Wild, “Properties of Some Low Melt Fusible Solder Alloys” (Paper presented at INTER/NEPCON, Brighton, U.K., 19–21 October 1971).
3. W.J. Tomlinson and I. Collier, “The Mechanical Properties and Microstructures of Copper and Brass Joints Soldered with Eutectic Tin-Bismuth Solder,” J. Mater. Sci., 22 (1987), pp. 1835–1839.
4. S. Pattanaik and V. Raman, “Deformation and Fracture of Bismuth-Tin Eutectic Solder,” Materials Developments in Microelectronic Packaging, ed. P.J. Singh (Materials Park, OH: ASM, 1991), pp. 251–257.
5. Z. Gou et al., “Monotonic Properties and Low-Cycle Fatigue of Several Soft Solder Alloy Systems,” in Ref. 4, pp. 155–162.