Effect of low Bi content on mechanical properties of Sn-Bi-Zn-In alloy and its joint with Cu
Author:
Affiliation:
1. Joining and Welding Research Institute Osaka University Ibaraki,Japan,Country
2. Graduate School of Engineering Osaka University,Suita,Japan
3. National Cheng Kung University,Department of Materials Science and Engineering,Tainan,Taiwan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939483.pdf?arnumber=9939483
Reference12 articles.
1. Flexible and printed organic transistors: From materials to integrated circuits
2. Interfacial reaction between Sn-0.7Cu (-Ni) solder and Cu substrate
3. The effect of aging on microstructure, room temperature deformation, and fracture of Sn-Bi/Cu solder joints
4. A general strategy of in-situ warpage characterization for solder attached packages with digital image correlation method
5. Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging
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