The effect of aging on microstructure, room temperature deformation, and fracture of Sn-Bi/Cu solder joints-Reference-Cited by-同舟云学术

The effect of aging on microstructure, room temperature deformation, and fracture of Sn-Bi/Cu solder joints

Published:1994-07 Issue:7 Volume:23 Page:611-617
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Raeder C. H.,Felton L. E.,Tanzi V. A.,Knorr D. B.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02653346.pdf

Reference17 articles.

1. P.J. Watlitsky and F.G. Yost,Proc. National Electronics Packaging and Production Conf., (Des Plaines, IL: Cahners Exposition Group, 1992), p. 1671.

2. P.T. Vianco and D.L. Frear,JOM 45 (8), 14 (1993).

3. S. Jin,JOM 45 (8), 13 (1993).

4. W.J. Tomlinson and I. Collier,J. Mater. Sci. 22,1835 (1987).

5. Z. Gou, A.F. Sprecher, Jr. and H. Conrad,Materials Develop- ments in Microelectronic Packaging Conf. Proc.,ed. P.J. Singh, (Materials Park, OH: ASM International, 1991), p. 155.

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