Impact reliability enhancement approach of Sn–Bi–Zn–in alloy bumps under high-humidity and high-temperature tests-Reference-Cited by-同舟云学术

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Impact reliability enhancement approach of Sn–Bi–Zn–in alloy bumps under high-humidity and high-temperature tests

Published:2023-11 Issue: Volume:27 Page:7013-7023
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Jin Zhi,Fujiwara Shunsuke,Takenaka Junichi,Hagio Koichi,Nishikawa Hiroshi

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference36 articles.

1. A review of lead-free solders for electronics applications;Cheng;Microelectron Reliab,2017

2. Reliability-enhanced microscale Ag sintered joint doped with AlN nanoparticles;Wang;Mater Lett,2023

3. Lead-free solders in microelectronics;Abtew;Mater Sci Eng R Rep,2000

4. Review of microstructure and properties of low temperature lead-free solder in electronic packaging;Xu;Sci Technol Adv Mater,2020

5. Microstructure and mechanical properties of Sn–Bi, Sn–Ag and Sn–Zn lead-free solder alloys;Osório;J Alloys Compd,2013

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