Funder
The Key project of State Key Laboratory of Advanced Welding and Joining
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference29 articles.
1. N. Odashima, O. Minho, M. Kajihara et al., Formation of intermetallic compounds and microstructure evolution due to isothermal reactive diffusion at the interface between solid Co and liquid Sn. J. Electron. Mater. 49(2), 1568–1576 (2020)
2. M. Zhao, L. Zhang, Z.Q. Liu et al., Structure and properties of Sn–Cu lead-free solders in electronics packaging. Sci. Technol. Adv. Mater. 20(1), 421–444 (2019)
3. K.K. Xu, L. Zhang, L. Sun et al., The influence of carbon nanotubes on the properties of Sn solder. Mater. Trans. 61(3), 718–722 (2020)
4. J. Mittal, K. Lin, Diffusion of elements during reflow aging of Sn–Zn solder in liquid state on Ni/Cu substrate theoretical and experimental study. Soldering Surf. Mount Technol. 30(3), 137–144 (2018)
5. L. Zhang, Z.Q. Liu, Inhibition of intermetallic compounds growth at Sn-58Bi/Cu interface bearing CuZnAl memory particles (2–6 μm). J. Mater. Sci. 31(3), 2466–2480 (2020)
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