Constitutive relations on creep for SnAgCuRE lead-free solder joints-Reference-Cited by-同舟云学术

Constitutive relations on creep for SnAgCuRE lead-free solder joints

Published:2004-09 Issue:9 Volume:33 Page:964-971
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Chen Zhigang,Shi Yaowu,Xia Zhidong

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-004-0023-z.pdf

Reference16 articles.

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3. J.E. Bird, A.J. Mukherjee, and J.E. Dorn, Quantitative Relation between Properties and Microstructure (Jerusalem: Israel Universities Press, 1969), p. 255.

4. Z. Chen, Y. Shi, and Z. Xia, J. Electron. Mater. 32, 235 (2003).

5. Z. Mei, D. Grivas, M.C. Shine, and J.W. Morris, Jr., J. Electron. Mater. 19, 1273 (1990).

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