Superplastic creep of eutectic tinlead solder joints-Reference-Cited by-同舟云学术

Superplastic creep of eutectic tinlead solder joints

Published:1990-11 Issue:11 Volume:19 Page:1273-1280
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Mei Z.,Grivas D.,Shine M. C.,Morris J. W.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02673342.pdf

Reference27 articles.

1. M. C. Shine, L. R. Fox, and J. W. Sofia, Brazing & Soldering No. 9, 11 (1985), and M. C. Shine and L. R. Fox, Low Cycle Fatigue, ASTM STP942, 588 (1987).

2. C. H. M. Jenkins, J. Inst. Metals,40, 21 (1928).

3. C. E. Pearson, J. Inst. Metals54, 111 (1934).

4. D. H. Avery and W. A. Backofen, Trans. ASM.58, 551 (1965).

5. H. E. Cline and T. H. Alden, Trans. AIME239, 710 (1967).

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