1. ‘Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment’, Official Journal of the European Union L 37, 13·2·2003, 19.
2. ‘World electronic industries 2008–2013’, Executive summary, Decision Etudes Conseil, Paris, France, 2009.
3. Arra M, Xie DJ, Shangguan D: ‘Performance of Pb-free solder joints under dynamic mechanical loading’, Proc. IEEE 52nd ECTC, May 2002, San Diego, CA, USA, IEEE, 1256–1562.
4. Drop impact reliability testing for lead-free and lead-based soldered IC packages
5. Wong EH, Rajoo R, Mai YW, Seah SKW, Tsai KT, Yap LM: ‘Drop impact: fundamentals and impact characterisation of solder joints’, Proc. IEEE 55th ECTC, June 2005, Lake Buena Vista, FL, USA, IEEE, 1202–1209.