Author:
Chong Desmond Y.R.,Che F.X.,Pang John H.L.,Ng Kellin,Tan Jane Y.N.,Low Patrick T.H.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference24 articles.
1. Arra M, Xie DJ, Shangguan D. Performance of Pb-free solder joints under dynamic mechanical loading. In: Proceedings of the 52nd electronic components and technology conference, 2002.
2. Wong EH, Lim KM, Lee N, Seah S, Hoe C, Wang J. Drop impact test—Mechanics and physics of failure. In: Proceedings of the 4th electronics packaging technology conference, 2002. p. 327–33.
3. Lim CT, Ang CW, Tan LB, Seah SKW, Wong EH. Drop impact survey of portable electronic products. In: Proceedings of the 53rd electronic components and technology conference, 2003. p. 113–20.
4. Xie DJ, Arra M, Yi S, Rooney D. Solder joint behavior of area array packages in board level drop for handheld devices. In: Proceedings of the 53rd electronic components and technology conference, 2003. p. 130–5.
5. Wang YQ, Low KH, Che FX, Pang HLJ, Yeo SP. Modeling and simulation of printed circuit board drop test. In: Proceedings of the 5th electronics packaging technology conference, 2003. p. 263–8.
Cited by
114 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献