Effect of Minor Sb Additions on Thermal Properties, Microstructure and Microhardness of Sn–Ag–Cu High-Temperature Solder Alloys
Author:
Publisher
Pleiades Publishing Ltd
Subject
Materials Chemistry,Condensed Matter Physics
Link
https://link.springer.com/content/pdf/10.1134/S0031918X22601974.pdf
Reference31 articles.
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2. A. Z. Miric and A. Grusd, “Lead-free alloys,” Solder. Surf. Mt. Technol. 10, 19–25 (1998). https://doi.org/10.1108/09540919810203793
3. I. Anderson, J. Walleser, and J. L. Harringa, “Observations of nucleation catalysis effects during solidification of SnAgCuX solder joints,” JOM 59 (7), 38–43 (2007). https://doi.org/10.1007/s11837-007-0087-3
4. M. Huang, C. M. L. Wu, J. K. L. Lai, and Y. C. Chan, “Developing a lead-free solder alloy Sn–Bi–Ag–Cu by mechanical alloying,” J. Electron. Mater. 29, 1021–1026 (2000). https://doi.org/10.1007/s11664-000-0166-5
5. B. Zhang, H. Ding, and X. Sheng, “Reliability study of board-level lead-free interconnections under sequential thermal cycling and drop impact,” Microelectron. Reliab. 49, 530–536 (2009). https://doi.org/10.1016/j.microrel.2009.02.024
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