Microstructure, mechanical, and thermal properties of the Sn–1Ag–0.5Cu solder alloy bearing Fe for electronics applications-Reference-Cited by-同舟云学术

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Microstructure, mechanical, and thermal properties of the Sn–1Ag–0.5Cu solder alloy bearing Fe for electronics applications

Published:2012-08 Issue: Volume:551 Page:160-168
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Shnawah Dhafer Abdul-Ameer,Said Suhana Binti Mohd,Sabri Mohd Faizul Mohd,Badruddin Irfan Anjum,Che Fa Xing

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference46 articles.

1. Microstructural evolution in lead-free solder alloys: Part I. Cast Sn–Ag–Cu eutectic

2. Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength

3. Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties

4. Lead‐free alloys

Cited by 63 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation of microstructure, corrosion and mechanical properties of iron and holmium modified Sn-3.0Ag0.5Cu solder alloy with ultrasonic treatment;Materials Characterization;2024-09

2. Investigating the influence of rotating magnetic field (RMF) on intermetallic compound crystallization, thermal and mechanical properties in lead-free Sn-Ag-Cu solder alloys during solidification;Materials Today Communications;2024-06

3. Thermal, microstructural, wettability and mechanical properties of Sn1.0Ag0.5Cu composite solder modified with Ti nanoparticles;Materials Characterization;2024-06

4. Microstructure and Shear Properties Evolution of Minor Fe-Doped SAC/Cu Substrate Solder Joint under Isothermal Aging;Acta Metallurgica Sinica (English Letters);2024-04-15

5. Experimental and Simulation Study of Babbitt Alloy/Steel Composite in Swing Cold Metal Transfer (CMT) Welding Under Different Heat Input;JOM;2024-02-23

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