Drop impact test - mechanics & physics of failure
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/8446/26603/01185692.pdf?arnumber=1185692
Cited by 61 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A Study of JEDEC Board-Level Drop Test Performance Prediction Trend of BGA Package with SAC1205 Under Different Key Factors;2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2022-10-26
2. Humidity and corrosion susceptibility of molded packages under mechanical impact Novel package level impact test to provoke micro-damage;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25
3. Reliability Characterization of Solder Joints in Electronic Systems Through a Neural Network Aided Approach;IEEE Access;2022
4. Measurement bruise volume of olive during impact test using FEM and quality evaluation of extracted olive oil;Food Science & Nutrition;2021-08-03
5. Survivability of embedded microelectronics in precision guided projectiles: Modeling and characterization;International Journal of Impact Engineering;2021-08
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