A Study of JEDEC Board-Level Drop Test Performance Prediction Trend of BGA Package with SAC1205 Under Different Key Factors
Author:
Affiliation:
1. Reliability Laboratory / Advanced Semiconductor Engineering Inc. 26 Chin 3rd Rd., Nantze Export Processing Zone,Nantze,Kaohsiung,811
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9966654/9966628/09966688.pdf?arnumber=9966688
Reference6 articles.
1. Drop impact test - mechanics & physics of failure
2. Drop Impact Reliability ¿ A Comprehensive Summary
3. A study on the correlation between experiment and simulation board level drop test for SSD;kang;2017 18th International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),2017
4. Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages
5. Weibull Analysis Handbook
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