Drop Impact Reliability ¿ A Comprehensive Summary-Reference-Cited by-同舟云学术

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Drop Impact Reliability ¿ A Comprehensive Summary

Published:2005-06 Issue: Volume: Page:
ISSN:
Container-title:2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis
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Author:

Wong E.h.,Mai Y-w,Seah S.k.w.,Rajoo R.,Lim T.b.,Lim C.t.,Field J.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4017407/4017408/04017440.pdf?arnumber=4017440

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Study of JEDEC Board-Level Drop Test Performance Prediction Trend of BGA Package with SAC1205 Under Different Key Factors;2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2022-10-26

2. Study on the mechanical-electric effect law of dynamic output voltage of board level mounted BaTiO3-MLCC under high impact;Measurement;2022-02

3. A novel impact test system for more efficient reliability testing;Microelectronics Reliability;2010-08

4. Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull;Microelectronics Reliability;2009-08

5. Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements;Journal of Electronic Packaging;2009-02-12

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