A novel impact test system for more efficient reliability testing-Reference-Cited by-同舟云学术

A novel impact test system for more efficient reliability testing

Published:2010-08 Issue:8 Volume:50 Page:1125-1133
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Hokka Jussi,Mattila Toni T.,Li Jue,Teeri Jarmo,Kivilahti Jorma. K.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference27 articles.

1. Date M, Shoji T, Fujiyoshi M, Sato K, Tu KN. Impact reliability of solder joints. In: Proceedings of the 54th electronic components and technology conference; 2004. p. 668–74.

2. JEDEC Standard JESD22-B117A, Solder ball shear; October 2006.

3. JEDEC Standard JESD22-B109, Flip chip tensile pull; June 2002.

4. JEDEC Standard JESD22-B115, Solder ball pull; May 2007.

5. Reiff D, Bradley E. A novel mechanical shock test method to evaluate lead-free BGA solder joint reliability. In: Proceedings of the 55th electronic components and technology conference; 2005. p. 1519–25.

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