Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints-Reference-Cited by-同舟云学术

Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints

Published:2002-10 Issue:10 Volume:31 Page:1122-1128
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Chen Z. G.,Shi Y. W.,Xia Z. D.,Yan Y. F.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-002-0052-4.pdf

Reference13 articles.

1. B.P. Richards, C.L. Levoguer, and K. Nimmo, “An Analysis of the Current Status of Lead-Free Soldering” (Presentation), Department of Trade and Industry, United Kingdom, 1999.

2. Y. Miyazawa and T. Ariga, Mater. Trans. 42, 776 (2001).

3. B. Richards and K. Nimmo, “An Analysis of the Current Status of Lead-Free Soldering—Update 2000,” Department of Trade and Industry, United Kingdom, 2000.

4. S. Grum, Electron. Packaging Prod. 40, 13 (2000).

5. D.R. Frear, Electrotechnik Informationstechnik 118, 81 (2001).

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