Microstructural studies of ultrarapidly quenched foils of zinc-doped indium–tin eutectic alloys
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://link.springer.com/article/10.1007/s10853-018-2964-2/fulltext.html
Reference29 articles.
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3. Nadia A (2009) The fabrication of composite solder by addition of copper nano powder into Sn–3.5Ag solder. In: Proceedings of the international conference on electronic packaging technology & high density packaging (ICEPT-HDP’09), pp 607–610
4. Bath J ed (2007) Lead-free soldering, Springer, Chapter 2: fundamental properties of Pb-free solder alloys
5. O’Neill T (2018) Life after SAC http://www.aimsolder.com/Accessed . Accessed May 15 2018
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1. Sn – Zn – Ga alloys for leadfree soldering obtained by rapid quenching;Journal of the Belarusian State University. Physics;2020-06-04
2. Evolution and Growth Mechanism of Cu2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging;Journal of Electronic Materials;2020-01-02
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