Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties-Reference-Cited by-同舟云学术

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Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties

Published:2017-03 Issue: Volume:698 Page:317-328
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Tu Xiaoxuan,Yi Danqing,Wu Jing,Wang Bin

Funder

Dongguan Jinzhong Electronics Co. Ltd.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference34 articles.

1. High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints, Acta;Alam;Mater,2006

2. Interfacial reaction between Sn-Ag-Cu solder and Co-P films with various microstructures;Lu;Acta. Mater.,2013

3. Lead-free solders in microelectronics;Abtew;J. Mater. Sci. Eng. R.,2000

4. Ag3Sn plate formation in the solidification of near ternary eutectic Sn-Ag-Cu alloys;Henderson;J. Mater. Res.,2002

5. Effects of intermetallic formation at the interface between copper and lead-tin solder;Parent;J. Mater. Sci.,1988

Cited by 48 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation of microstructure, corrosion and mechanical properties of iron and holmium modified Sn-3.0Ag0.5Cu solder alloy with ultrasonic treatment;Materials Characterization;2024-09

2. Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties;Journal of Materials Research and Technology;2024-07

3. Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification;Journal of Electronic Materials;2024-04-10

4. Influence of Fe and Ho additions on Sn-3.0Ag-0.5Cu solder alloy: Microstructure, electrochemical and mechanical properties;Materials Characterization;2023-11

5. Effect of In Addition on the Microstructure and Mechanical Properties of Sn-0.7Cu-0.8Zn/Cu Solder Joints;Journal of Electronic Materials;2023-04-26

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