Effects of intermetallic formation at the interface between copper and lead-tin solder-Reference-Cited by-同舟云学术

Effects of intermetallic formation at the interface between copper and lead-tin solder

Published:1988-07 Issue:7 Volume:23 Page:2564-2572
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Parent J. O. G.,Chung D. D. L.,Bernstein I. M.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF01111916.pdf

Reference20 articles.

1. R. A. Hagstrom andR. N. Wild, in Proceedings of the Technical Programme, International NEPCON (National Electronic Packaging and Production Conference), Brighton, October 1969, (Kiver, Communications Inc.) p. 271.

2. K. R. Stone, R. Duckett, S. Muckett andM. Warwick,Brazing Soldering No. 4 (1983) 20.

3. W. J. Tomlinson andN. J. Bryan,J. Mater. Sci. 21 (1986) 103.

4. S. J. Muckett, M. E. Warwick andP. E. Davis,Plating Surf. Finishing 79 (1986) 44.

5. H. N. Keller andJ. M. Morabito,Surf. Interface Anal. 3 (1981) 16.

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