Improved microstructure and mechanical properties for SnBi solder alloy by addition of Cr powders-Reference-Cited by-同舟云学术

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Improved microstructure and mechanical properties for SnBi solder alloy by addition of Cr powders

Published:2019-06 Issue: Volume:789 Page:805-813
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Zhu Wenbo,Zhang Weiwei,Zhou Wei,Wu Ping

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference37 articles.

1. Growth kinetics of the Cu3Sn phase and void formation of sub-micrometre solder layers in Sn-Cu binary and Cu-Sn-Cu sandwich structures;Li;J. Alloys Compd.,2013

2. Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5 Cu solder joints under extreme temperature thermal shock;Tian;Mater. Sci. Eng. A,2018

3. Microstructure and tensile behavior of Sn-5Sb lead-free solder alloy containing Bi and Cu;Esfandyarpour;Mater. Sci. Eng. A,2011

4. High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints;Alam;Acta Mater.,2006

5. Lead-free solders in microelectronics;Abtew;J. Mater. Sci. Eng. R.,2000

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