Growth kinetics of the Cu3Sn phase and void formation of sub-micrometre solder layers in Sn–Cu binary and Cu–Sn–Cu sandwich structures
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference25 articles.
1. Failure mechanisms of solder interconnects under current stressing in advanced electronic packages
2. SOP: What Is It and Why? A New Microsystem-Integration Technology Paradigm-Moore's Law for System Integration of Miniaturized Convergent Systems of the Next Decade
3. 3D design activities at Fermilab—Opportunities for physics
4. A. Huffman, Pixel 2008, Sept 22–26 Fermilab, Batavia IL, 2008.
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