Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer
Author:
Funder
Aalto-Yliopisto
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference99 articles.
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4. Wafer-level low-temperature solid-liquid inter-diffusion bonding with thin Au-Sn layers for MEMS encapsulation;Temel;J. Micro Syst.,2021
5. L. Skogström, J. Li, T.T. Mattila, V. Vuorinen, “MEMS reliability,” in Handbook of Silicon Based MEMS Materials and Technologies, 2020, pp. 851–876.
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