Wafer-Level Hermetic Package by Low-Temperature Cu/Sn TLP Bonding with Optimized Sn Thickness-Reference-Cited by-同舟云学术

Wafer-Level Hermetic Package by Low-Temperature Cu/Sn TLP Bonding with Optimized Sn Thickness

Published:2017-05-10 Issue:10 Volume:46 Page:6111-6118
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Wu Zijian,Cai Jian,Wang Qian,Wang Junqiang,Wang Dejun

Funder

The National High technology Research and Development Program of China

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/article/10.1007/s11664-017-5546-1/fulltext.html

Reference27 articles.

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4. C.W. Lin, H.A. Yang, W.C. Wang, and W. Fang, J. Micromech. Microeng. 17, 6 (2007).

5. C. Gillot, J.L. Pornin, A. Arnaud, E. Lagoutte, N. Sillon, and J.C. Souriau, in Proceedings of the IEEE 7th Electronic Packaging Technology Conference (1996), p. 243.

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