Rapid formation, grain refinement and shear property of high-temperature-stable full IMC joints
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference32 articles.
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3. Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints;Wang;Mater Char,2020
4. Growth behavior and morphology evolution of interfacial (Cu,Ni)6Sn5 in (001)Cu/Sn/Ni micro solder joints;Lai;Mater Char,2022
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2. Accelerated Solid-Liquid Interdiffusion Bonding of Cu Joint Using a Cu10ni Alloy Mesh Reinforced Sac305 Composite Solder;2023
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