Pulse electric current induced interfacial ductile phase on improving the mechanical properties of the Au20Sn/Cu solder joints
Author:
Funder
Natural Science Foundation of Hunan Province
National Science and Technology Project of China
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s10854-024-13002-8.pdf
Reference65 articles.
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3. L. Zhang, Z.G. Wang, J.K. Shang, Current-induced weakening of Sn3.5Ag0.7Cu Pb-free solder joints. Scripta Mater. 56(5), 381–384 (2007)
4. X. Hu, Y. Li, Y. Liu et al., Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging. Microelectron. Reliab. 54(8), 1575–15829 (2014)
5. M.A. Fazal, N.K. Liyana, Saeed Rubaiee et al., A critical review on performance, microstructure and corrosion resistance of Pb-free solders. Measurement 134, 897–907 (2019)
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