A critical review on performance, microstructure and corrosion resistance of Pb-free solders
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,Electrical and Electronic Engineering,Condensed Matter Physics,Instrumentation
Reference120 articles.
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4. Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates;Kotadia;J. Alloy. Compd.,2012
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