Microstructure and tensile behavior of Sn–5Sb lead-free solder alloy containing Bi and Cu
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference33 articles.
1. Lead-free Solders in Microelectronics
2. Tin–lead (SnPb) solder reaction in flip chip technology
3. Effect of cooling rate on the room-temperature impression
4. Indentation creep of lead-free Sn–9Zn and Sn–8Zn–3Bi solder alloys
5. Impression creep of the rare-earth doped Sn–2%Bi lead-free solder alloy
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1. Simulation and Prediction of Creep Rate, Activation Energy, and Rupture Time of Sn94Sb5Ag1 Lead-Free Solder Alloy Using Artificial Neural Network Modeling;Journal of Electronic Materials;2024-07-02
2. Strain rate-dependent tensile deformation and failure behavior in single-crystal β-Sn;Modern Physics Letters B;2024-04-27
3. Correlation of microstructure with thermal and tensile creep properties of novel Sn-5Sb-0.5Cu alloy reinforced with Co particles for soldering applications;Physica Scripta;2024-04-04
4. Sb Additions in Near-Eutectic Sn-Bi Solder Decrease Planar Slip;Journal of Electronic Materials;2023-08-24
5. Dislocation density and twinning-related constitutive modeling of substructural evolution in Sn-5Sb-0.5(Ag/Cu) alloys under monotonic deformation;Journal of Alloys and Compounds;2023-03
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