Interfacial reaction between Sn–Ag–Cu solder and Co–P films with various microstructures
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference47 articles.
1. Electronics Without Lead
2. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
3. Lead-free Solders in Microelectronics
4. Current density redistribution from no current crowding to current crowding in Pb-free solder joints with an extremely thick Cu layer
5. Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages
Cited by 57 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Nano-scale mechanistic model for microstructural reliability in reactive hybrid solder joints;Materials Characterization;2024-10
2. Investigation into the strength of β-Sn/α-CoSn3 and Co/α-CoSn3 interfaces with Ni-doped α-CoSn3 using first-principles calculations;Computational Materials Science;2024-10
3. Systematic Study of Liquid-State Interfacial Reactions Between Co and In-Sn Solders with Varying Sn Contents;Journal of Electronic Materials;2024-08-29
4. IMC Growth and Microstructure Evolution of Co13%P/SAC/Co-13%P Solder Joint under Thermal-Electrical Coupling Fields;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
5. Effect of the ultrasonic-assisted soldering on the interfacial reaction and IMC growth behavior of SAC305 solder with Cu alloy substrates;Journal of Materials Science: Materials in Electronics;2023-07
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3