Electronics Without Lead-Reference-Cited by-同舟云学术

Electronics Without Lead

Published:2005-06-03 Issue:5727 Volume:308 Page:1419-1420
ISSN:0036-8075
Container-title:Science
language:en
Short-container-title:Science

Author:

Li Yi¹,Moon Kyoung-sik¹,Wong C. P.¹

Affiliation:

1. The authors are in the School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA.

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

Reference15 articles.

1. Lau J., Wong C. P., Lee N. C., Lee S. W. R., Eds. Electronics Manufacturing: With Lead-free, Halogen-Free, and Conductive-Adhesive Materials (McGraw Hill, New York, 2002).

2. Puttlitz K. J., Stalter Kathleen A., Eds. chap. 1, Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Dekker, New York, 2004).

3. Abet M., Selvaduray G., Mater. Sci. Eng.27, 95 (2000).

4. Miric A. Z., Soldering and Surface Mount Technology10, 19 (1998).

5. Hwang J. S., Environment-Friendly Electronics: Lead-Free Technology (Electrochemical Publications, Port Erin, UK, 2001).

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