IMC Growth and Microstructure Evolution of Co13%P/SAC/Co-13%P Solder Joint under Thermal-Electrical Coupling Fields-Reference-Cited by-同舟云学术

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IMC Growth and Microstructure Evolution of Co13%P/SAC/Co-13%P Solder Joint under Thermal-Electrical Coupling Fields

Published:2023-08-08 Issue: Volume:23 Page:1-4
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Rong Jing¹,Yang Donghua²,Guo Lei¹,Hu Jie¹,Xiang Weiguo¹,Hu Kailun¹,Zhang Chunhong¹,An Huaping¹

Affiliation:

1. Chongqing University of Technology,College of Materials Science and Engineering,Chongqing,China

2. Chongqing University of Technology,Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology,Chongqing,China

Funder

National Natural Science Foundation of China

Chongqing Municipal Education Commission

Chongqing University of Technology

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492170.pdf?arnumber=10492170

Reference5 articles.

1. Research Progress on the Reliability of Solder Joint for Advanced Microelectronic Packaging

2. Influences of Sn grain orientation on element migration and interfacial reaction in microsolder joints;Bai;Electronics & Packaging,2023

3. Interfacial reaction between Sn–Ag–Cu solder and Co–P films with various microstructures

4. Strategies for solder joints with high shear strength, slow interfacial consumption, ductile intermetallic compounds using hybrid crystalline-amorphous Co-P coatings

5. Effects of amorphous Co W and Ni W barrier layers on the evolution of Sn/Cu interface

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