Research Progress on the Reliability of Solder Joint for Advanced Microelectronic Packaging
Author:
Publisher
Chinese Journal of Mechanical Engineering
Subject
Applied Mathematics,Computer Science Applications,Mechanical Engineering
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Electrochemical simulation of electrodeposition growth of copper in Through Silicon Via (TSV);2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. IMC Growth and Microstructure Evolution of Co13%P/SAC/Co-13%P Solder Joint under Thermal-Electrical Coupling Fields;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
3. Experiments and analysis for accurate controlling of an ultra-microvolume adhesive droplet in dispensing;The International Journal of Advanced Manufacturing Technology;2023-08-04
4. Study on Determination and Prediction Method of ultra-micro-volume Adhesive Droplet Volume Parametres;2023-01-12
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