Author:
Liu Shuang,Ma Limin,Zhen Cheng,Wang Yishu,Li Dan,Guo Fu
Funder
National Natural Science Foundation of China
Beijing Municipal Science and Technology Commission
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference40 articles.
1. Reliability issues of lead-free solder joints in electronic devices;Jiang;Sci. Technol. Adv. Mater.,2019
2. A review of lead-free solders for electronics applications;Cheng;Microelectron. Reliab.,2017
3. Reliability challenges in 3D IC packaging technology;Tu;Microelectron. Reliab.,2011
4. L. Sun, M.H. Chen, L. Zhang, P. He, L.S. Xie, Recent progress in SLID bonding in novel 3D-IC technologies, J. Alloys Compd. 2020; 818; 10.1016/j.jallcom.2019.152825.
5. Metallurgical challenges in microelectronic 3D IC packaging technology for future consumer electronic products;Tu;Sci. China-Technol. Sci.,2013
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献