1. A study on wafer level vacuum packaging for MEMS devices;Lee;Journal of Micromechanics and Microengineering,2003
2. Vacuum packaging for microsensors by glass–silicon anodic bonding;Hemmi;Sensors and Actuators,1994
3. Planar processed polysilicon sealed cavities for pressure transducer arrays;Guckel;International Electron Devices Meeting (IEDM),1984
4. Microelectromechanical filters for signal processing;Lin;IEEE/ASME Jourmal of Microelectromechanical Systems,1998
5. Permeable polysilicon etch-access windows for microshell fabrication;Lebouitz;Transducers’95,1995