A modelling and simulation approach for radio frequency (RF) parasitic effects reduction in wafer-level packaging (WLP) of RF-MEMS passive components

Author:

Iannacci J.ORCID

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference18 articles.

1. Allan R (2013) RF MEMS switches are primed for mass-market applications. https://www.mwrf.com/technologies/active-components/article/21844989/rf-mems-switches-are-primed-for-massmarket-applications. Accessed 17 Mar 2020

2. Chakraborty A, Gupta B, Sarkar BK (2014) Design, fabrication and characterization of miniature RF MEMS switched capacitor based phase shifter. Microelectron J 45:1093–1102. https://doi.org/10.1016/j.mejo.2014.05.009

3. Chen B, Sekhar VN, Jin C, Lim YY, Toh JS, Fernando S, Sharma J (2013) Low-loss broadband package platform with surface passivation and TSV for wafer-level packaging of RF-MEMS devices. IEEE Trans Compon Packag Manuf Technol 3:1443–1452. https://doi.org/10.1109/TCPMT.2013.2263932

4. Elger G, Jordan R, Suchodoletz M, Oppermann H (2002) Development of an low cost wafer level flip chip assembly process for high brightness leds using ausn metallurgy. In Proceedings of. international symposium on microelectronics IMAPS 1-4

5. Iannacci J (2013) Practical guide to RF-MEMS. Wiley-VCH, Weinheim. https://doi.org/10.1002/9783527680856

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