Wafer level packaging compatible with millimeter-wave antenna-Reference-Cited by-同舟云学术

Wafer level packaging compatible with millimeter-wave antenna

Published:2012-01 Issue:1 Volume:173 Page:238-243
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Herth E.,Seok S.,Rolland N.,Lasri T.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference29 articles.

1. Fabrication and impact performance of three-dimensionally integrated microstrip antennas with microstrip and coaxial feeding;Yao;J. Micromech. Microeng.,2009

2. Polydimethylsiloxane membranes for millimeter-wave planar ultra flexible antennas;Tiercelin;J. Micromech. Microeng.,2006

3. 60-GHz CPW-fed post-supported patch antenna using micromachining;Kim;IEEE Microw. Wireless Compon. Lett. Tech.,2005

4. Material selection procedure for RF-MEMS;Guisbiers;J. Microelectr. Eng.,2010

5. Moisture lifetime testing of RF MEMS switches packaged in liquid crystal polymer;Kingsley;IEEE Trans. Compon. Packag. Technol.,2008

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analysis of SAW Sensor Coated by a Biocompatible Parylen Polymer;2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP);2023-05-28

2. ZnO and Al-doped ZnO Sol-Gel Properties;2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP);2021-08-25

3. Experimental and theoretical investigation of bifurcated wafer warpage evolution in the wafer level packaging processes;Journal of Materials Science: Materials in Electronics;2020-08-18

4. Advanced and reliable GaAs/AlGaAs ICP-DRIE etching for optoelectronic, microelectronic and microsystem applications;Microelectronic Engineering;2018-12

5. Conducting Polymers as Elements of Miniature Biocompatible Sensor;Green Electronics;2018-06-20