1. 薛捷 美国 Cisco System Incorporated 2023美国工程院院士 Reliability of Microelectronics Packaging in the Era of EnergyWise and Borderless Networks
2. Ben Yoo, Sung-Joo 美国 University of California Davis LLM: Realizing Low-Latency Memory by Exploiting Embedded Silicon Photonics for Irregular Workloads
3. Seung-Boo,Jung 韩国 Sungkyunkwan University Effects of Ni(P) layer thickness and Pd layer type in thin-Au/Pd/Ni(P) surface finishes on interfaci..
4. Khodabakhshi, Farzad 伊朗 University of Tehran Nanoindentation creep properties of lead-free nanocomposite solders reinforced by modified carbon na..
5. Seung-Boo,Jung 韩国 Sungkyunkwan University Interfacial reactions and mechanical properties of Sn-3.0Ag-0.5Cu solder with pure Pd or Pd(P) layer..
6. Seung-Boo,Jung 韩国 Sungkyunkwan University Effects of crystalline and amorphous Pd layers on initial interfacial reactions at Sn-3.0Ag-0.5Cu/th..
7. Michael,Pecht 美国 University of Maryland Assembly Options and Challenges for Electronic Products With Lead-Free Exemption
8. Ben Yoo, Sung-Joo 美国 University of California Davis Enabling Scalable Disintegrated Computing Systems With AWGR-Based 2.5D Interconnection Networks
9. Ben Yoo, Sung-Joo 美国 University of California Davis 3D Photonics as Enabling Technology for Deep 3D DRAM Stacking
10. Cheung, Yiu-ming 中国 香港浸会大学 Fan-Out Wafer-Level Packaging for Heterogeneous Integration
11. Jamie J,Kruzic 澳大利亚 University of New South Wales Surface Finish Effects on Fracture Behavior of Sn-4Ag-0.5Cu Solder Joints
12. Junichi,Koike 日本 Tohoku University Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints
13. Allan F,Bower 美国 Brown University In-situ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stres..
14. Eric,Chason 美国 Brown University In-situ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stres..
15. Duh, Jenq-Gong 中国 台湾国立清华大学 Improving the impact toughness of Sn-Ag-Cu/Cu-Zn Pb-free solder joints under high speed shear testin..
16. Fuqian,Yang 美国 University of Kentucky Effect of DC current on tensile creep of pure tin
17. Bieler, Thomas R. 美国 Michigan State University Influence of High-G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu ..
18. Duh, Jenq-Gong 中国 台湾国立清华大学 Suppressing the growth of Cu-Sn intermetallic compounds in Ni/Sn-Ag-Cu/Cu-Zn solder joints during th..
19. Eric,Chason 美国 Brown University Correlating whisker growth and grain structure on Sn-Cu samples by real-time scanning electron micro..
20. Bieler, Thomas R. 美国 Michigan State University Impact of Isothermal Aging and Sn Grain Orientation on the Long-Term Reliability of Wafer-Level Chip..