Effect of DC current on tensile creep of pure tin
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference48 articles.
1. Lead-free Solders in Microelectronics
2. Deformation behavior of tin and some tin alloys
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4. Self-buckling of micromachined beams under resistive heating
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