Surface Finish Effects on Fracture Behavior of Sn–4Ag–0.5Cu Solder Joints
Author:
Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-319-51097-2_19
Reference9 articles.
1. C.F. Tseng, T.K. Lee, G. Ramakrishna, K.C. Liu, J.G. Duh, Suppressing Ni3Sn4 formation in the Sn-Ag-Cu solder joints with Ni-P/Pd/Au surface finish. Mater. Lett. 65, 3216–3218 (2011)
2. T.K. Lee, H.T. Ma, K.C. Liu, J. Xue, Impact of isothermal aging on long-term reliability of fine-pitch ball grid array packages with Sn-Ag-Cu solder interconnects: surface finish effects. J. Electron. Mater. 39, 2564–2573 (2010)
3. T.K. Lee, J.G. Duh, Effect of isothermal aging on the long-term reliability of fine-pitch Sn-Ag-Cu and Sn-Ag solder interconnects with and without board-side Ni surface finish. J. Electron. Mater. 43, 4126–4133 (2014)
4. S.M. Hayes, N. Chawla, D.R. Frear, Interfacial fracture toughness of Pb-free solders. Microelectron. Reliab. 49, 269–287 (2009)
5. ASTM Standard E399, 2009, Standard test method for linear-elastic plane-strain fracture toughness K Ic of metallic materials, ASTM International, West Conshohocken, Pennsylvania, USA. Doi: 10.1520/E0399-09E01 ; http://www.astm.org/
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1. Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints;Recent Progress in Lead-Free Solder Technology;2022
2. Interfacial fracture toughness of sintered hybrid silver interconnects;Journal of Materials Science;2019-12-01
3. Microstructure and size effect of interfacial intermetallic on fracture toughness of Sn3.0Ag0.5Cu solder interconnects;Engineering Fracture Mechanics;2018-10
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