Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects

Author:

Lee Tae-Kyu,Ma Hongtao,Liu Kuo-Chuan,Xue Jie

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference18 articles.

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4. W. Xie, T.-K. Lee, K.-C. Liu, and J. Xue, IEEE 60th Electronic Components and Technology Conference (ECTC) (Las Vegas, NV, June 2010).

5. H.G. Song, J.W. Morris Jr., and F. Hua, JOM 56, 30 (2002).

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