Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints-Reference-Cited by-同舟云学术

Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints

Published:2022 Issue: Volume: Page:217-238
ISSN:2364-3293
Container-title:Recent Progress in Lead-Free Solder Technology
language:
Short-container-title:

Author:

Atiqah A.,Jalar A.,Bakar M. A.,Ismail N.

Publisher

Springer International Publishing

Link

https://link.springer.com/content/pdf/10.1007/978-3-030-93441-5_10

Reference59 articles.

1. Abdullah, S. H., Ahmad, I., Jalar, A. (2006). The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging. In 2006 25th International Conference on Microelectronics, MIEL 2006—Proceedings (pp. 605–610).

2. Aisha, I. S., & Ourdjini, A. (2012). Effect of multiple reflow on IMC formation using various surface finishes. International Journal of Microstructure and Materials Properties, 7(6), 502–516.

3. Amli, S. F. M., Salleh, M. A. A. M., Said, R. M., Razak, N. R. A., Wahab, J. A., Ramli, M. I. I. (2019). Effect of surface finish on the wettability and electrical resistivity of Sn-3.0 Ag-0.5 Cu solder. In IOP Conference Series: Materials Science and Engineering (p. 12029). IOP Publishing.

4. Amli, S. F. N. M., Salleh, M. A. A. M., Ramli, M. I. I., Razak, N. R. A., Yasuda, H., Chaiprapa, J., & Nogita, K. (2021). Effects of surface finish on Sn-3.0 Ag-0.5 Cu solder joint microstructure and strength. Journal of Electronic Materials, 50(3), 855–868.

5. Anuar, R. A. M., & Osman, S. A. (2020). The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces. Soldering & Surface Mount Technology.